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MI-MegaMod Family

DC/DC Converter in Rugged, Chassis Mount Package for MIL Applications

  1. Home
  2. MI-MegaMod Family
  • Overview

  • Data Sheets

  • Library

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  • Overview

Description

MI-MegaMods offer up to a total of 300 watts from one, two, or three outputs. Each unit incorporates one, two, or three component-level Vicor MI-200 / MI-J00 DC-DC converters in a chassis-mount package. Full-size Mega Modules use full-brick size MI-200 converters; half-size Mega Modules use half-brick-size MI-J00 converters. In addition, the MI-MegaMod chassis mount packaging can also be used on the MI-IAM, MI-RAM, and MI-AIM modules.

Standard features such as wide output trimming / programming, current limiting, remote sense, logic enable / disable combine to offer a high degree of protection, versatility, and reliability for power systems.

Specifications

Input Voltages:
  • 28 Vdc
  • 155 Vdc
  • 165 Vdc
  • 270 Vdc
Output Voltages:
  • 2 – 48 Vdc
Output Power:
  • Up to 300 W
Efficiency:
  • 80 – 90%
Dimensions:
  • See mechanical drawing on data sheet

Features

  • Up to 13.5 W/in3
  • One, two or three outputs
  • MIL-STD-704D/E/F transient compliance for 28 and 270 Vdc
  • MIL-STD-1399A compliance for 155 Vdc
  • High efficiency
  • Remote sense
  • Environmental stress screening
  • ZCS power architecture
  • Low noise FM control
  • Data Sheets

Data Sheets

  • MI-MegaMod Family Data Sheet
  • Library

Design Guides / Manuals

Download Entire Manual

  • VI-200, VI-J00 Design Guide and Applications Manual

Download Individual Chapters

  1. Zero-Current Switching
  2. DC-DC Converter Pinouts
  3. Module Dos and Donts
  4. Overcurrent Protection
  5. Output Voltage Trimming
  6. Multiple Gate In Connections
  7. Applications Circuits / Converter Array Design Considerations
  8. Using Boosters and Parallel Arrays
  9. EMC Considerations
  10. Optional Output Filters
  11. Battery Charger (BatMod)

Filter and Front-End Module Chapters

  1. AC Input Module (AIM / MI-AIM)
  2. Harmonic Attenuator Module (HAM)
  3. Input Attenuator Module (IAM / MI-IAM)
  4. Ripple Attenuator Module (RAM / MI-RAM)
  5. Offline Front End

Power System Chapters

  1. DC Input Power System (ComPAC / MI-ComPAC Family)
  2. AC Input Power System (FlatPAC Family)
  3. AC Input Power System (PFC FlatPAC)

General Chapters

  1. Thermal and Module Mounting Considerations
  2. Thermal Curves
  3. Lead Free Pins (RoHS)
  4. Tin Lead Pins
  5. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
  6. Product Weights
  7. Glossary of Technical Terms

Environmental Stress Screening

Every MI Family module undergoes extensive post-production environmental stress screening (ESS) before shipment to verify compliance with Vicor’s high quality and performance standards and to eliminate early life failures.

The current program of unpowered temperature cycling and dynamic power cycling burn-in is the result of years of test data analysis, process improvement, and screening strength calculations based on DOD-HDBK-344A, Hughes Model RADC-TR-86-149, and IES ESSEH Guidelines. To ensure the most effective routine for precipitating module failures, Vicor continually evaluates its ESS program and makes appropriate changes as new data become available or as product improvements occur. After burn-in and temperature cycling, each module undergoes final electrical testing over the specified temperature range. The program is outlined below.

MI-Family Module Screening I-Grade M-Grade
Operating Temperature Mi-200 -40°C to +85°C -55°C to +85°C
Mi-J00 -40°C to +100°C -55°C to +100°C
Storage Temperature Mi-200 -55°C to +100°C -65°C to +100°C
Mi-J00 -55°C to +125°C -65°C to +125°C
Temperature Cycling
17°C per minute nominal rate of change,
dwell time until product stabilization.
12 cycles
-65°C to +100°C
12 cycles
-65°C to +100°C
Ambient Test @ 25°C Yes Yes
Power Cycling Burn-In
– Power on 10 min., off 15 min.
– Module temperature cycling 35°C to 80°C
– Load up to 100 W
– Module output continuously monitored while enabled
12 hours, 29 cycles 96 hours, 213 cycles
Functional and Parametric ATE Tests
Low & high temp. -40°C to +85°C -55°C to +85°C
AC Hi-Pot Test Yes Yes
Visual Inspection
Before packing into ESD containers Yes Yes

Environmental Qualification

Fully encapsulated, Vicor’s MI-Family modules utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the most harsh environments. In addition to providing mechanical rigidity,the encapsulant is thermally conductive to eliminate hot spots and aid in heat transfer to the baseplate. Two grades, I & M, are available with temperatures to -55°C operating and -65°C storage.

To verify the suitability of Vicor’s MI Family products for harsh environments, MI-Family modules have been subjected to the environmental testing requirements of MIL-STD-810 and MIL-STD-202. These tests, listed below, are performed at an independent laboratory. Additional environmental tests can be done upon individual customer request. Some of those performed for specific customer applications include ESD (DOD-HDBK-263), Structure Borne (Acoustic) Noise, Transportation Vibration, Flammability, Terminal Strength, Thermal Shock, and Power Conditioning. Contact the factory for details.

Altitude
– MIL-STD-810D, Method 500.2, Procedure III, explosive decompression (40 K ft.).
– MIL-STD-810D, Method 500.2, Procedure II, 40,000 ft., 1000 – 1500 ft./min. to 70,000 ft., unit functioning
Explosive Atmosphere
– MIL-STD-810C, Method 511.1, Procedure I
Vibration – MIL-STD-810D, Method 514.3, Procedure I, category 6, helicopter, 20
– MIL-STD-810D, Method 514.3 random: 10 – 300 Hz @ 0.02 g²/Hz, 2000 Hz @ 0.002 g²/Hz, 3.9 total g rms
3 hrs / axis Sine: 30 Hz @ 20 g, 60 Hz @ 10 g, 90 Hz @ 6.6 g, 120 Hz @ 5.0 g, 16.0 total g rms, 3 axes- MIL-STD-810E, Method 514.4, Table 514.4-VII, ±6 db/octave, 7.7 g rms, 1hr/axis

Shock
– MIL-STD-810D, Method 516.3, Procedure I, functional shock, 40 g
– MIL-STD-202F, Method 213B, 18 pulses, 60 g, 9 msec
– MIL-STD-202F, Method 213B, 75 g, 11 ms saw tooth shock
– MIL-STD-202F, Method 207A, 3 impacts / axis, 1, 3, 5 feet
Acceleration
– MIL-STD-810D, Method 513.3, Procedure II Operational test, 9 g for 1 minute along 3 mutually perpendicular axes
Humidity
– MIL-STD-810F, Method 507.4, 95% Relative Humidity
Solder Test
– MIL-STD-202, Method 208, 8 hr. aging
Fungus
– MIL-STD-810C, Method 508.1
Salt Atmosphere
– MIL-STD-810C, Method 509.1

Mean Time Between Failure (MTBF)

Because operating temperature is one of the most important factors in determining overall module reliability, it is imperative that the user’s system design allow for efficient heat transfer from the baseplate to system ambient. Since temperature and failure rate are exponentially related, just a 10°C decrease in baseplate temperature can have a dramatic increase in MTBF. Due to patented zero-voltage/zero-current switching topology, Vicor converters are highly efficient compared to those with more traditional topologies. High efficiency translates into both smaller size and lower temperature rises. To minimize thermal impedance, all major power dissipating components are mounted directly to the baseplate.

Below are representative calculated MTBF values based on MIL-HDBK-217F. If you require information about a specific model, contact Vicor with the model number, expected baseplate temperature, and operating environment to obtain an individually prepared report.

Model Number Baseplate Temperature MTBF in 1,000 Hrs.
G.B G.F. A.I.C. N.S.
MI-J71-MY 25°C 3,778 1,894 1,136 1,117
50°C 2,311 1,155 693 682
65°C 1,780 890 534 525
MI-276-MW 25°C 3,755 1,878 1,127 1,108
50°C 2,291 1,145 687 678
65°C 1,765 882 529 521

Mechanical Drawings

Drawing Number
Description Technical Drawing
10874 Outline Drawing for MI-MegaMod PDF | DXF
07045 Outline Drawing for MI-MegaMod Jr. 1-Up PDF | DXF
07494 Outline Drawing for MI-MegaMod Jr. 2-Up PDF | DXF
07495 Outline Drawing for MI-MegaMod Jr. 3-Up PDF | DXF
  • Filters

DC Input Filters

  • MI-IAM – Input Attenuator Module – DC Input, front-end modules providing transient protection, inrush current limiting and EMI filtering for MI-200 and MI-J00 DC-DC converters.

DC Output Filters

  • MI-RAM – Ripple Attenuator Module – MI-RAM may be connected to MI-200 or MI-J00 converters with output voltages from 5 – 50 Volts, to limit total output noise to less than 3 mV peak-to-peak at loads up to 20 Amps.
  • MicroRAM – Ripple Attenuator Module – The MicroRAM combines both active and passive filtering to achieve greater than 40 dB of noise attenuation from over a range of 3 – 30 Vdc.

AC Input Filters and Front Ends

  • MI-AIM – AC Input Front-End Module – The MI-AIM is an AC front-end module which interfaces directly with AC mains to provide line rectification, EMI fltering, transient protection, and inrush lmiting.

How to reach us!

+43 (0) 2282 3144

office@vitecpower.com

Bahnstraße 65-67/2/2
A-2230 Gänserndorf,
Österreich

Vitec Power GmbH

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