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MIL-COTS High-Voltage BCM™ Bus Convertervitecpower2017-01-27T10:06:45+01:00
  • Overview

  • Data Sheets

  • Library

  • Evaluation Boards / Filters

  • Accessories

  • Overview

Description

The MIL-COTS Bus Converter Module (BCM) is a high efficiency (>96%), Sine Amplitude Converter (SAC) operating from MIL-STD-704E/F 270 V and delivering an isolated 30.0 – 41.25 V or 38.3 – 55.0 V. The BCM is suitable for use with the MIL-COTS PRM™ Regulator and VTM™ Current Multiplier, and is ideal for aircraft distributed power applications.

The bus converter achieves a power density of >919 W/in3 in a V•I Chip™ package compatible with standard pick-and-place and surface-mount assembly processes. Due to its high conversion efficiency and safe operating temperature range, the module does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures and long life in the harshest environments.

Specifications

Input Voltage:
  • 270 V nominal
Output Voltages:
  • 30.0 – 41.25 V (MBCM270F338M235A00)
  • 38.3 – 55.0 V (MBCM270F450M270A00)
Output Power:
  • 235 W (MBCM270F338M235A00)
  • 270 W (MBCM270F450M270A00)
Operation:
  • –55°C to 125°C Tj operation
Dimensions per module:
  • 1.28″ x 0.87″ x 0.265″
    (32.5 x 22.0 x 6.73 mm)

Features

  • MIL-STD-704E/F compliant
  • ZVS / ZCS isolated Sine Amplitude Converter™ (SAC™)
  • High efficiency up to >96%
  • Power density >919 W/in3, reduces power system footprint by >40%
  • Low weight
  • Can be paralleled to create multi-kW arrays
  • Data Sheets

Data Sheets

  • MBCM270F338M235A00 (Formerly VMB0004MFJ
  • MBCM270F450M270A00
  • Library

Application Notes

  • AN:006 – A Filter Solution for the BCM
  • AN:008 – V•I Chip Bus Converter Module (BCM) Thermal Management
  • AN:009 – V•I Chip Soldering Recommendations
  • AN:016 – Using BCM™ Bus Converters in High Power Arrays
  • AN:017 – RoHS-Compliant Through-hole V•I Chip Soldering Recommendations

Design Guides / Manual

  • UG:010 – V•I Chip High Voltage BCM Evaluation Board User Guide

White Papers

  • FPA Overview: An Introduction to FPA
  • High-Density, High-Efficiency, Light-Weight MIL-COTS DC-DC Solution

Safety Approvals

  • cURus – UL 60950-1, CSA 60950-1
  • cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
  • CE Marked – Low Voltage Directive (2006/95/EC)
  • CB Certificate – IEC 60950-1:2001

Mechanical Drawings and Models

Description Lead Type Product Outline Drawing 3-D Model Drawing
Full-Chip MIL-COTS HV BCM J-Lead PDF | DXF IGS | SAT | STP
Through-Hole PDF | DXF IGS | SAT | STP
  • Evaluation Boards / Filters

Evaluation Boards

MIL-COTS HV BCM Customer Evaluation Board
HV Full Chip
P/N Input

Voltage (V)

Output

Voltage (V)

Output

Power (W)

User Guide
VMB0004MFJ-EB 270 33 235 PDF
  • Accessories

Heat Sinks

  • AN:008 – V•I Chip Bus Converter Module (BCM) Thermal Management Application Note
For Full Chip All Heat Sinks are RoHS Compatible
Description Fin
Height
P/N Product Assembly Drawing Product Outline Drawing 3-D Model Drawing
Transverse Fins 11 mm 34072 * PDF PDF |DXF IGS | SAT | STP
Transverse Fins 6.3 mm 34073 * PDF PDF |DXF IGS | SAT | STP
Longitudinal Fins 11 mm 34074 * PDF PDF |DXF IGS | SAT | STP
Longitudinal Fins 6.3 mm 34075 * PDF PDF |DXF IGS | SAT | STP
* Push pins not included

Push Pins

Push Pins For Full-Size V•I Chip Modules (100 pieces per package)
All Heat Sinks are RoHS Compatible
Pin Size P/N Product Assembly Drawing Product Outline Drawing
0.051″ – 0.069″ PCB 32434 PDF PDF
0.070″ – 0.104″ PCB 32435 PDF PDF
0.105″ – 0.132″ PCB 32436 PDF PDF
0.133″ – 0.156″ PCB 32437 PDF PDF

Vitec Power GmbH
Bahnstraße 65-67/2/2
2230 Gänserndorf
Austria

+43 (0) 2282 3144
office@vitecpower.com

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