V•I Chip BCM Series

High Efficieny and High Density DC/DC Bus Converter

Description

The V•I Chip Bus Converter Module (BCM) is a Sine Amplitude Converter that offers superior performance, the highest efficiency, and highest power density in the smallest package available. BCMs provide an isolated intermediate bus voltage to power non-isolated POL (Point-of-Load) converters or serve as an isolated voltage source for ATE, server, telecom, and industrial control applications. Some additional features include:

  • Fast response time
  • Low noise
  • Saves board area, materials and total system cost
  • Through-hole option available, except in half-chip package

Full-chip and half-chip BCMs are compatible with standard pick-and-place and surface-mount assembly processes.

Specifications

Full-Chip BCM:
  • Input Voltage: 48 V (38 – 55 V)
  • Output Voltage: 1.19 – 55.0 V
  • Output Power: 135 – 300 W
  • Output Current: 6 – 90 A
  • Efficiency: Up to 96%
Half-Chip BCM:
  • Input Voltage: 48 V (38 – 55 V)
  • Output Voltage: 12 V
  • Output Power: 120 W
  • Output Current: 11.3 A
  • Efficiency: Up to 95%
High Voltage BCM:
  • Input Voltages:
    270 V (240 – 330 V)
    350 V (330 – 365 V)
    380 V (360 – 400 V)
  • Output Voltage: 10 – 13 V, 42 – 50 V
  • Output Power: 235 – 325 W
  • Output Current: 7.0 – 28.0 A
  • Efficiency: Up to 96%
Dimensions per module:
  • Full-Chip: 1.28″ x 0.87″ x 0.265″
    (32.5 x 22.0 x 6.73 mm)
  • Half-Chip: 0.87″ x 0.65″ x 0.265″
    (22.0 x 16.5 x 6.73 mm)

Features

  • High power density
  • Small footprint
  • Low weight
  • High frequency ZVS / ZCS Sine Amplitude Converter (SAC™)
  • Isolated output
  • Bulk capacitance elimination

Data Sheet Matrix

Whole Family BCM Shortform Whole Family HV BCM Shortform

Output Voltage (V) Input Voltage (V)
48 (38 – 55) 270 (240 – 330) 352 (330 – 365) 384 (360 – 400)
1.5 B048F015T14
3 B048F030T21
4 B048F040T20
6 B048F060T24
8 B048F080T24
9.6 B048F096T24
11 B352F110T24 B352F110T30 BCM352F110T300A00 (Formerly VIB0001TFJ)
12 BCM48BH120T120A00 (Formerly VIB0101THJ) B048F120T30 B384F120T30
12.5 BCM352F125T300A00 (Formerly VIB0010TFJ)
16 B048F160T24
24 B048F240T30
32 B048F320T30
33 MBCM270F338M235A00 (Formerly VMB0004MFJ)
44 BCM352F440T330A00 (Formerly VIB0003TFJ)
48 B048F480T30 BCM384F480T325A00 (Formerly VIB0002TFJ)

Safety Approvals

Full-Chip BCM
Half-Chip BCM
Full-Chip HV BCM

Mechanical Drawings and Models

All V•I Chips are RoHS Compatible
Description Lead Type Product Outline Drawing 3-D Model Drawing
Full-Chip BCM with J-Lead mounting J-Lead PDF | DXF IGS | SAT | STP
Full-Chip BCM with through-hole mounting Through-Hole PDF | DXF IGS | SAT | STP
Half-Chip BCM with J-Lead mounting J-Lead PDF | DXF IGS | SAT | STP

Evaluation Boards

An easy way to get up and running with the BCMTM Bus Converter The BCM Evaluation Board has been designed to facilitate the verification of the V•I Chips superior performance in the areas of power density, efficiency (over a wide load range), fast response and quiet, low-noise operation. An evaluation board is also available for the half-chip BCM.

BCMTM Bus Converter Customer Evaluation Board
Full Chip
P/N Input
Voltage (V)
Output
Voltage (V)
Output
Power (W)
User Guide
B048F015T14-EB 48 1.5 135 PDF
B048F030T21-EB 48 3.0 210 PDF
B048F040T20-EB 48 4.0 200 PDF
B048F060T24-EB 48 6.0 240 PDF
B048F080T24-EB 48 8.0 240 PDF
B048F096T24-EB 48 9.6 240 PDF
B048F120T30-EB 48 12 300 PDF
B048F160T24-EB 48 16 240 PDF
B048F240T30-EB 48 24 300 PDF
B048F320T30-EB 48 32 300 PDF
B048F480T30-EB 48 48 300 PDF
HV Full Chip
P/N Input
Voltage (V)
Output
Voltage (V)
Output
Power (W)
User Guide
B352F110T24-EB 352 11 240 PDF
B352F110T30-EB 352 11 300 PDF
BCD352F110T300A00
(Formerly VIB0001TFJ-EB)
352 11 300 PDF
BCD352F125T300A00
(Formerly VIB0010TFJ-EB)
352 12.5 300 PDF
BCD352F440T330A00
(Formerly VIB0003TFJ-EB)
352 44 325 PDF
B384F120T30-EB 384 12 300 PDF
BCD384F480T325A00
(Formerly VIB0002TFJ-EB)
384 48 325 PDF
Half Chip
P/N Input
Voltage (V)
Output
Voltage (V)
Output
Power (W)
User Guide
BCD48BH120T120A00
(Formerly VIB0101THJ-EB)
48 12 120 PDF

Input Filters

Input Filter Carrier (Evaluation) Boards

  • QPI-9-CB1 Carrier Board – Compatible with 24 V Input V•I Chip “-CB” Boards, up to 6 Amps
  • QPI-10-CB1 Carrier Board – Compatible with 48 V Input V•I Chip “-CB” Boards, up to 6 Amps
  • QPI-11-CB1 Carrier Board – Compatible with 24 V Input V•I Chip Module “-CB” Boards, up to 7 Amps
  • QPI-12-CB1 Carrier Board – Compatible with 48 V input V•I Chip Module “-CB” Boards, up to 7 Amps

Heat Sinks

For Full Chip All Heat Sinks are RoHS Compatible
Description Fin
Height
P/N Product Assembly Drawing Product Outline Drawing 3-D Model Drawing
Transverse Fins 11 mm 34072* PDF PDF|DXF IGS|SAT|STP
Transverse Fins 6.3 mm 34073* PDF PDF|DXF IGS|SAT|STP
Longitudinal Fins 11 mm 34074* PDF PDF|DXF IGS|SAT|STP
Longitudinal Fins 6.3 mm 34075* PDF PDF|DXF IGS|SAT|STP
* Push pins not included
For Half Chip All Heat Sinks are RoHS Compatible
Description Fin
Height
P/N Product Assembly Drawing Product Outline Drawing 3-D Model Drawing
Transverse Fins 11 mm 32784* PDF PDF|DXF IGS|SAT|STP
Transverse Fins 6.3 mm 32786* PDF PDF|DXF IGS|SAT|STP
Longitudinal Fins 11 mm 32783* PDF PDF|DXF IGS|SAT|STP
Longitudinal Fins 6.3 mm 32785* PDF PDF|DXF IGS|SAT|STP
* Push pins not included

Push Pins

Push Pins For Full-Size V•I Chip Modules (100 pieces per package)
All Heat Sinks are RoHS Compatible
Pin Size P/N Product Assembly Drawing Product Outline Drawing
0.051″ – 0.069″ PCB 32434 PDF PDF
0.070″ – 0.104″ PCB 32435 PDF PDF
0.105″ – 0.132″ PCB 32436 PDF PDF
0.133″ – 0.156″ PCB 32437 PDF PDF
All Heat Sinks are RoHS Compatible
Pin Size P/N Product Assembly Drawing Product Outline Drawing
0.051″ – 0.069″ PCB 33622 PDF PDF
0.070″ – 0.104″ PCB 33623 PDF PDF
0.105″ – 0.132″ PCB 33624 PDF PDF
0.133″ – 0.156″ PCB 33625 PDF PDF