MIL-COTS High-Voltage BCM™ Bus Converter - Vitecpower

Description

The MIL-COTS Bus Converter Module (BCM) is a high efficiency (>96%), Sine Amplitude Converter (SAC) operating from MIL-STD-704E/F 270 V and delivering an isolated 30.0 – 41.25 V or 38.3 – 55.0 V. The BCM is suitable for use with the MIL-COTS PRM™ Regulator and VTM™ Current Multiplier, and is ideal for aircraft distributed power applications.

The bus converter achieves a power density of >919 W/in³ in a V•I Chip™ package compatible with standard pick-and-place and surface-mount assembly processes. Due to its high conversion efficiency and safe operating temperature range, the module does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures and long life in the harshest environments.

Specifications

Input Voltage:

270 V nominal

Output Voltages:

30.0 – 41.25 V (MBCM270F338M235A00)
38.3 – 55.0 V (MBCM270F450M270A00)

Output Power:

235 W (MBCM270F338M235A00)
270 W (MBCM270F450M270A00)

Operation:

–55°C to 125°C T_j operation

Dimensions per module:

1.28″ x 0.87″ x 0.265″
(32.5 x 22.0 x 6.73 mm)

Features

MIL-STD-704E/F compliant
ZVS / ZCS isolated Sine Amplitude Converter™ (SAC™)
High efficiency up to >96%
Power density >919 W/in³, reduces power system footprint by >40%
Low weight
Can be paralleled to create multi-kW arrays

Data Sheets

Application Notes

Design Guides / Manual

UG:010 – V•I Chip High Voltage BCM Evaluation Board User Guide

White Papers

Safety Approvals

cURus – UL 60950-1, CSA 60950-1
cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
CE Marked – Low Voltage Directive (2006/95/EC)
CB Certificate – IEC 60950-1:2001

Mechanical Drawings and Models

Description	Lead Type	Product Outline Drawing	3-D Model Drawing
Full-Chip MIL-COTS HV BCM	J-Lead	PDF \| DXF	IGS \| SAT \| STP
Full-Chip MIL-COTS HV BCM	Through-Hole	PDF \| DXF	IGS \| SAT \| STP

Evaluation Boards

MIL-COTS HV BCM Customer Evaluation Board

HV Full Chip

P/N	InputVoltage (V)	OutputVoltage (V)	OutputPower (W)	User Guide

VMB0004MFJ-EB	270	33	235	PDF

Heat Sinks

AN:008 – V•I Chip Bus Converter Module (BCM) Thermal Management Application Note

For Full Chip

All Heat Sinks are RoHS Compatible

Description	Fin Height	P/N	Product Assembly Drawing	Product Outline Drawing	3-D Model Drawing
Transverse Fins	11 mm	34072 *	PDF	PDF \|DXF	IGS \| SAT \| STP
Transverse Fins	6.3 mm	34073 *	PDF	PDF \|DXF	IGS \| SAT \| STP