• 28 Vdc
• 155 Vdc
• 165 Vdc
• 270 Vdc

• 2 – 48 Vdc

• Up to 300 W

• 80 – 90%

• See mechanical drawing on data sheet

• Up to 13.5 W/in³
• One, two or three outputs
• MIL-STD-704D/E/F transient compliance for 28 and 270 Vdc
• MIL-STD-1399A compliance for 155 Vdc
• High efficiency
• Remote sense
• Environmental stress screening
• ZCS power architecture
• Low noise FM control

Download Entire Manual

• VI-200, VI-J00 Design Guide and Applications Manual

Download Individual Chapters

1. Zero-Current Switching
2. DC-DC Converter Pinouts
3. Module Dos and Donts
4. Overcurrent Protection
5. Output Voltage Trimming
6. Multiple Gate In Connections
7. Applications Circuits / Converter Array Design Considerations
8. Using Boosters and Parallel Arrays
9. EMC Considerations
10. Optional Output Filters
11. Battery Charger (BatMod)

Filter and Front-End Module Chapters

1. AC Input Module (AIM / MI-AIM)
2. Harmonic Attenuator Module (HAM)
3. Input Attenuator Module (IAM / MI-IAM)
4. Ripple Attenuator Module (RAM / MI-RAM)
5. Offline Front End

Power System Chapters

1. DC Input Power System (ComPAC / MI-ComPAC Family)
2. AC Input Power System (FlatPAC Family)
3. AC Input Power System (PFC FlatPAC)

General Chapters

1. Thermal and Module Mounting Considerations
2. Thermal Curves
3. Lead Free Pins (RoHS)
4. Tin Lead Pins
5. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
6. Product Weights
7. Glossary of Technical Terms

Every MI Family module undergoes extensive post-production environmental stress screening (ESS) before shipment to verify compliance with Vicor’s high quality and performance standards and to eliminate early life failures.

The current program of unpowered temperature cycling and dynamic power cycling burn-in is the result of years of test data analysis, process improvement, and screening strength calculations based on DOD-HDBK-344A, Hughes Model RADC-TR-86-149, and IES ESSEH Guidelines. To ensure the most effective routine for precipitating module failures, Vicor continually evaluates its ESS program and makes appropriate changes as new data become available or as product improvements occur. After burn-in and temperature cycling, each module undergoes final electrical testing over the specified temperature range. The program is outlined below.

MI-Family Module Screening			I-Grade	M-Grade
Operating Temperature		Mi-200	-40°C to +85°C	-55°C to +85°C
		Mi-J00	-40°C to +100°C	-55°C to +100°C
Storage Temperature		Mi-200	-55°C to +100°C	-65°C to +100°C
		Mi-J00	-55°C to +125°C	-65°C to +125°C
Temperature Cycling
17°C per minute nominal rate of change, dwell time until product stabilization.			12 cycles -65°C to +100°C	12 cycles -65°C to +100°C
Ambient Test @ 25°C			Yes	Yes
Power Cycling Burn-In
- Power on 10 min., off 15 min. - Module temperature cycling 35°C to 80°C - Load up to 100 W - Module output continuously monitored while enabled			12 hours, 29 cycles	96 hours, 213 cycles
Functional and Parametric ATE Tests
Low & high temp.			-40°C to +85°C	-55°C to +85°C
AC Hi-Pot Test			Yes	Yes
Visual Inspection
Before packing into ESD containers			Yes	Yes

Fully encapsulated, Vicor’s MI-Family modules utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the most harsh environments. In addition to providing mechanical rigidity,the encapsulant is thermally conductive to eliminate hot spots and aid in heat transfer to the baseplate. Two grades, I & M, are available with temperatures to -55°C operating and -65°C storage.

To verify the suitability of Vicor’s MI Family products for harsh environments, MI-Family modules have been subjected to the environmental testing requirements of MIL-STD-810 and MIL-STD-202. These tests, listed below, are performed at an independent laboratory. Additional environmental tests can be done upon individual customer request. Some of those performed for specific customer applications include ESD (DOD-HDBK-263), Structure Borne (Acoustic) Noise, Transportation Vibration, Flammability, Terminal Strength, Thermal Shock, and Power Conditioning. Contact the factory for details.

Because operating temperature is one of the most important factors in determining overall module reliability, it is imperative that the user’s system design allow for efficient heat transfer from the baseplate to system ambient. Since temperature and failure rate are exponentially related, just a 10°C decrease in baseplate temperature can have a dramatic increase in MTBF. Due to patented zero-voltage/zero-current switching topology, Vicor converters are highly efficient compared to those with more traditional topologies. High efficiency translates into both smaller size and lower temperature rises. To minimize thermal impedance, all major power dissipating components are mounted directly to the baseplate.

Below are representative calculated MTBF values based on MIL-HDBK-217F. If you require information about a specific model, contact Vicor with the model number, expected baseplate temperature, and operating environment to obtain an individually prepared report.

Model Number	Baseplate Temperature	MTBF in 1,000 Hrs.
		G.B	G.F.	A.I.C.	N.S.
MI-J71-MY	25°C	3,778	1,894	1,136	1,117
	50°C	2,311	1,155	693	682
	65°C	1,780	890	534	525
MI-276-MW	25°C	3,755	1,878	1,127	1,108
	50°C	2,291	1,145	687	678
	65°C	1,765	882	529	521

Drawing Number		Description			Technical Drawing
10874		Outline Drawing for MI-MegaMod			PDF | DXF
07045		Outline Drawing for MI-MegaMod Jr. 1-Up			PDF | DXF
07494		Outline Drawing for MI-MegaMod Jr. 2-Up			PDF | DXF
07495		Outline Drawing for MI-MegaMod Jr. 3-Up			PDF | DXF